Cost breakdown for U.S. LED packages 2018

Typical cost breakdown for LED packages in the U.S. in 2018

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Release date

January 2020

Region

United States

Survey time period

2018

Supplementary notes

The figures are based on inputs from DOE SSL Roundtable and Workshop attendees.
According to the source, the high-power package assumes a 2 mm2 LED die packaged on a ceramic substrate (3.5 mm x 3.5 mm) with a molded silicone lens. The mid-power PC-LED package assumes a two die (0.5 mm2 die) plastic leaded chip carrier (PLCC) 3030 package (3 mm x 3 mm).

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